Products / Parker / Thermal and Power Management / THERM-A-FORM T642 Cure-In-Place Potting And Underfill Materials
THERM-A-FORM™ T642 is a high thermal performance material with flexibility and low outgassing ideal for underfilling.
Description
THERM-A-FORM™ thermally conductive silicone elastomer products are
dispensable formin-place compounds designed for heat transfer
without excessive compressive force in electronics cooling
applications. These versatile liquid reactive materials can be
dispensed and then cured into complex geometries for cooling of
multi-height components on a PCB without the expense of a molded
sheet. Each compound is available in ready-to-use cartridge systems,
eliminating weighing, mixing, and degassing procedures.
THERM-A-FORM™ T64x and 164x Series
Features / Benefits
• Dispensable form-in-place gap filling, potting, sealing, and
encapsulating
• Excellent blend of high thermal conductivity, flexibility, and
ease of use
• Conformable to irregular shapes without excessive force on
components
• Ready-to-use cartridge system eliminates weighing, mixing, and
de-gassing steps
• Variety of kit sizes and configurations available to suit any
application (handheld twin-barrel cartridges, Semco® tubes, and
pneumatic applicators)
• Vibration damping
Product Attributes
T642
• High thermal performance with flexibility
• Ideal for underfilling
• Low outgassing