THERMFLOW® phase-change Thermal Interface Materials (TIMs) completely fill interfacial air gaps and voids. They also displace entrapped air between power dissipating electronic components. Phase-change materials are designed to maximize heatsink performance and improve component reliability.

Upon reaching the required melt temperature, the pad will fully change phase and attain minimum bond-line thickness (MBLT) - less than 0.001 inch or 0.0254mm, and maximum surface wetting. This results in practically no thermal contact resistance due to a very small thermal resitance path.
At room temperature, THERMFLOW materials are solid and easy to handle. This allows them to be consistently and cleanly applied as dry pads to a heat sink or component surface. THERMFLOW material softens as it reaches component operating temperatures. With light clamping pressure it will readily conform to both mating surfaces.
This ability to completely fill air gaps and voids typical of component packages and heat sinks allows THERMFLOW pads to achieve performance superior to any other thermal interface materials. Standard THERMFLOW products are electrically non-conductive however metal-to-metal contact is possible after the material undergoes phase-change, decreasing their electrical isolation properties. PC07DM-7 is the only phase-change materials recommended for use as a dielectric insulator. Chomerics offers two types of phase change materials—traditional thermal interface pads and Dual Phase Change Polymer Solder Hybrids.

Dual Phase Change Polymer Solder Hybrid Materials
Dual Phase Change Thermal
Interface Materials consist of binder and fillers which both phase- change to exhibit the lowest thermal impedance of the phase-change family. These Thermal Interface Materials provide superior long term reliability and performance. For optimum performance, the pads must be exposed to temperatures above 64ºC during operation or by a burn-in cycle to achieve lowest thermal impedance and highest thermal performance.


Features/Benefits
• Low thermal impedance
• Proven solution – years of production use in personal computer OEM applications
• Demonstrated reliability through thermal cycling and accelerated age testing
• Can be pre-applied to heat sinks
• Protective release liner prevents contamination of material prior to final component assembly
• Tabs available for easy removal of release liner (T710, T725*, T557, T777, PCO7DM)
* T725 is only offered with a tab
• Available in custom die-cut shapes, kiss-cut on rolls
• RoHS Compliant

Typical Applications
• Microprocessors
• Graphics Processors
• Chipsets
• Memory Modules
• Power Modules
• Power Semiconductors


Handling Information

These products are defined by Chomerics as “articles” according to the following generally recognized regulatory definition for articles:
An article is a manufactured item “formed to a specific shape or design during manufacturing,” which has “end use functions” dependent upon its size and shape during end use and which has generally “no change of chemical composition during its end use.” In addition:
• There is no known or anticipated exposure to hazardous materials/substances during routine and anticipated use of the product.
• The product’s shape, surface, and design is more relevant than its chemical composition.
These materials are not deemed by Chomerics to require an MSDS. For further questions, please contact Chomerics at 781-935-4850.


Application

Material may flow when oriented vertically, especially at higher temperatures. This does not affect thermal performance, but should be considered if appearance is important.


Clean Up

THERMFLOW material can be removed with solvens such a toluene, MEK or isopropyl alcohol.

T725
• Excellent thermal performance
• Inherently tacky – no adhesive required
• Ideal for vertical applications
• Sticky n'ature limits flowing in vertical applications
• Tabs available for easy removal