Products / Parker / Thermal and Power Management / THERM-A-FORM™ T644 Cure-In-Place Potting And Underfill Materials
THERM-A-FORM™ T644 is a high thermal performance very low modulus material for transferring heat from fragile electronic components
THERM-A-FORM™ thermally conductive silicone
elastomer products are dispensable formin-place compounds designed
for heat transfer without excessive compressive force in electronics
cooling applications. These versatile liquid reactive materials can
be dispensed and then cured into complex geometries for cooling of
multi-height components on a PCB without the expense of a molded
sheet. Each compound is available in ready-to-use cartridge systems,
eliminating weighing, mixing, and degassing procedures.
THERM-A-FORM™ T64x and 164x Series
Features / Benefits
• Dispensable form-in-place gap filling, potting, sealing, and
encapsulating
• Excellent blend of high thermal conductivity, flexibility, and
ease of use
• Conformable to irregular shapes without excessive force on
components
• Ready-to-use cartridge system eliminates weighing, mixing, and
de-gassing steps
• Variety of kit sizes and configurations available to suit any
application (handheld twin-barrel cartridges, Semco® tubes, and
pneumatic applicators)
• Vibration damping
Product Attributes
T644
• Very low modulus material for transferring heat from fragile
electronic components