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Working Time : 09:00 - 18:00
  • +994124898416

    Contact number

  • office@marinets.az

    Have a Question?

Products / Parker / Thermal and Power Management / THERM-A-FORM™ T644 Cure-In-Place Potting And Underfill Materials

THERM-A-FORM™ T644 Cure-In-Place Potting And Underfill Materials

THERM-A-FORM™ T644 Cure-In-Place Potting And Underfill Materials



THERM-A-FORM™ T644 is a high thermal performance very low modulus material for transferring heat from fragile electronic components

THERM-A-FORM™ thermally conductive silicone elastomer products are dispensable formin-place compounds designed for heat transfer without excessive compressive force in electronics cooling applications. These versatile liquid reactive materials can be dispensed and then cured into complex geometries for cooling of multi-height components on a PCB without the expense of a molded sheet. Each compound is available in ready-to-use cartridge systems, eliminating weighing, mixing, and degassing procedures.


THERM-A-FORM™ T64x and 164x Series
Features / Benefits

• Dispensable form-in-place gap filling, potting, sealing, and encapsulating
• Excellent blend of high thermal conductivity, flexibility, and ease of use
• Conformable to irregular shapes without excessive force on components
• Ready-to-use cartridge system eliminates weighing, mixing, and de-gassing steps
• Variety of kit sizes and configurations available to suit any application (handheld twin-barrel cartridges, Semco® tubes, and pneumatic applicators)
• Vibration damping


Product Attributes
T644
• Very low modulus material for transferring heat from fragile electronic components