Products / Parker / Emi Shielding / CHO-BOND 1030 Two Component Flexible Electrically Conductive Silicone Adhesive
CHO-BOND 1030 is a silver plated copper filled, one-component conductive silicone designed for applications where a flexible, strong, conductive electrical bond must be achieved.
Customer Value Proposition:
CHO-BOND 1030 is a silver plated copper filled, one-component
conductive silicone designed for applications where a flexible,
strong, conductive electrical bond must be achieved. CHO-BOND 1030
greatly simplifies the problem of bonding conductive silicone EMI
gaskets to metal substrates. It is formulated for relatively small
bond lines (less than 0.010 inches (0.25mm)), and should not be used
as an EMI caulk where bond lines are greater than 0.10 inches (0.25
mm). No volatile organic compounds (VOCs) and minimal shrinkage upon
curing make CHO-BOND 1030 a good choice for a variety of commercial
and military applications. CHOBOND 1030’s moisture cure silicone
polymer system allows it to cure to the touch in 24hrs and provides
a robust conductive bond over a wide range of application
temperatures. For best adhesion results, CHO-BOND 1030 should be
used in conjunction with CHOSHIELD 1086 primer. Typical applications
include bonding, repair, and attachment of EMI gaskets, and sealing
around EMI vents and windows.
Features and Benefits:
• One component
• Easy to use, no weighing or mixing required.
• Silver plated copper filler
• Good conductivity 0.050 ohm-cm.
• No VOCs
• Minimal shrinkage.
• Moisture cure silicone
• Flexible, 30 minute working life, rapid skin formation, > 200 psi
lap shear strength, 24 hr handling time, wide range of application
temperatures. 1 week for full cure.
• Non corrosive cure mechanism
• No corrosive by-products generated during curing to damage
substrate.
• Medium paste
• Can be used on overhead or vertical surfaces.