Customer Value Proposition:
CHO-BOND 584-208 is a two-component, silver filled conductive epoxy adhesive system designed for applications where a strong, highly conductive electrical bond must be achieved. CHO-BOND 584-208 is recommended for applications which require a conductive epoxy with an extended working life such as high volume part dispensing or complex part assembly operations. Curing of CHO-BOND 584-208 can be achieved in as little as 45 minutes with heat to minimize equipment downtime and increase manufacturing throughput. With a 1:1 weight mix ratio, CHO-BOND 584-208 is easy to handle and use. Typical applications include bonding and grounding of electrical components, cold soldering, and bonding and sealing machined enclosures.

Features and Benefits:
• Two component
• Fast heat cure, increases throughput, minimizes equipment downtime.
• Silver filler
• Good conductivity 0.002 ohm-cm
• Epoxy
• 60 minute working life, works well over wide temperature range, good chemical resistance >1000 psi lap shear, good for permanently bonding surfaces.
• 1:1 Weight mix ratio
• Easy to weigh out and mix.
• Medium paste
• May be dispensed out of very small needles, fill small cracks and voids. Can be used on overhead or vertical surfaces
• No VOCs
• Minimal shrinkage, no permits or ventilation required