Products / Parker / Emi Shielding / CHO-BOND 1038 One Component Electrically Conductive Silicone Sealant
CHO-BOND 1038 is a silver-plated copper filled, one-component conductive silicone. It is designed for use as a fillet, gap filler and seam sealant on electrical enclosures for EMI shielding or electrical grounding.
CHO-BOND 1038 is a silver-plated copper
filled, one-component conductive silicone. It is designed for use as
a fillet, gap filler and seam sealant on electrical enclosures for
EMI shielding or electrical grounding. Minimum recommended bond line
for CHOBOND 1038 is 0.007 inches (0.18mm). In addition, CHO-BOND
1038 may be used for EMI gasket repair, bonding, and attachment in
applications where moderate strength (less than 150 psi) is
required. CHO-BOND 1038’s moisture cure silicone polymer system
allows it to cure to the touch in 24 hours and provides a robust
conductive and environmental seal over a wide range of application
temperatures. For applications requiring zero volatile organic
compounds (VOCs) or minimal shrinkage, Parker Chomerics offers a
solvent free version of CHO-BOND 1038 called CHO-BOND 1121. For best
adhesion results, CHO-BOND 1038 should be used in conjunction with
CHOSHIELD 1086 primer. Typical applications include man portable
electronics, radar and communication systems, EMI vents, military
ground vehicles, and shelters.
Features and Benefits:
• One component
• Easy to use, no weighing or mixing required.
• Silver plated copper filler
• Excellent conductivity 0.010 ohm-cm
• Moisture cure silicone
• 30 minute working life, rapid skin formation, 24 hr handling time,
requires no pressure during curing, wide range of application
temperatures. 1 week for full cure.
• Non corrosive cure mechanism
• No corrosive by-products generated during curing to damage
substrate.
• Medium paste
• Easy to dispense, apply and spread, can be used on overhead or
vertical surfaces.
• No VOCs version: CHO-BOND 1121
• Minimal shrinkage, no permits or ventilation required.