Products / Parker / Emi Shielding / CHOFORM 5528 Ag/Cu Moisture Cure One Component Form-In-Place Silicone EMI Gasketing
Parker Chomerics CHOFORM 5528 Ag filled silicone is ideal for today’s densely populated electronics packaging. Full moisture cure in 24 hrs at 22 C with soft low closure force properties.
Parker Chomerics CHOFORM Automated EMI
Gasketing System is ideal for today’s densely populated electronics
packaging, particularly where intercompartmental isolation is
required to separate processing and signal generating functions.
CHOFORM is directly dispensed on castings, machined metal and
conductive plastic housings and board shields. It provides excellent
elec- trical contact to mating conductive sur- faces including
printed circuit board traces. CHOFORM is widely used in compartmen-
talized enclosures and other tightly pack- aged electronic devices
in military, telecom, transportation, aerospace and life science
applications.
The CHOFORM technology allows dispens- ing of precisely positioned,
conformable gaskets in very small cross sections that free valuable
package space. They provide the lowest total cost of ownership for
small cross section and complex pattern applica- tions. Parker
Chomerics CHOFORM and ParPHorm® Form-In-Place (FIP) materials can
reduce installed cost of an EMI gasket by up to 60%. The durable,
highly conduc- tive seals have low compression set, ensur- ing years
of effective EMI shielding and mechanical performance.
With gasket dispensing primarily software driven, CHOFORM technology
permits rapid prototyping, changes in design, and production
scale-up at nominal cost. Its inherent flexibility accommodates
batch runs or continu- ous production, from ten to ten million
parts. Wide acceptance of the CHOFORM automated gasket dispensing
system can be attributed to a successful blend of manufacturing and
materials expertise. The CHOFORM technology combined with a Parker
Chomerics supplied metal or conductive plastic housing or board
shield provides an integrated solution ready for the customers’
highest level of assembly. Individual compartment shielding or
grounding is often enhanced by placement of a secondary EMI product
such as a short length of fingerstock, fabric over foam, conductive
extrusion gasket or a microwave absorber. Thermal transfer from the
printed circuit boards’ heat generating devices to a metal hous- ing
wall or board shield can be accom- plished by placement of a soft
thermally conductive gap filler, dispensed thermal compound or gel.
Parker Chomerics has the technology to support all of these
application needs in a one stop integrated solution. Contact Park-
er Chomerics Applications for further details and assistance.
Product Features:
• Up to 60% space saved -flanges as narrow as 0.025” (0.76mm) can be
gasketed.
• More than 100 dB shielding effectiveness from 200 MHz to 12 GHz
with very small gasket beads.
• Excellent adhesion to common housing substrates and coatings.
• Highly compressible gaskets, ideal with limited deflection force.
• Quick turn-around of prototypes and samples. Parts typically
prototyped and shipped within several days and typically do not
require tooling.